The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Jun. 02, 2000
Masahito Ijuin, Fujisawa, JP;
Toru Nishikawa, Yokohama, JP;
Ryohei Sato, Yokohama, JP;
Mitsugu Shirai, Hadano, JP;
Yuzo Taniguchi, Kodaira, JP;
Kosuke Inoue, Yokohama, JP;
Masahide Harada, Yokohama, JP;
Tetsuya Hayashida, Nishitama-gun, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.