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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kelvin Doong

USPTO Granted Patents = 82 

Average Co-Inventor Count = 26.0

ph-index = 8

Forward Citations = 254(Granted Patents)

Forward Citations (Not Self Cited) = 202(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu City, TW (2017)
  • Hsinchu, TW (2017 - 2021)

Company Filing History:

goldMedal82 out of 203 
 
Pdf Solutions, Incorporated
 patents

Years Active: 2017-2021

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Areas of Expertise:
Integrated Circuits
Non-Contact Electrical Measurements
Semiconductor Wafer Processing
NCEM-Enabled Fill Cells
Test Structures
Charged Particle-Beam Inspection
Standard Cell Compatibility
Tip-to-Side Shorts
Via Open Configured Fill Cells
Corner Gap-Configured Fill Cells
Snake-Configured Fill Cells
Mesh-Style NCEM Pads
82 patents (USPTO):Explore Patents
1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),
2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),
5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),
6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),
7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),
8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),
9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),
10. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),
11. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),
12. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),
13. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),
14. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),
15. 10199293 - Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas (2019-02-05),

Title: The Innovative Contributions of Kelvin Doong in the Semiconductor Industry

Introduction: Kelvin Doong is a prominent inventor based in Hsinchu, Taiwan, recognized for his impressive portfolio of 82 patents. His work primarily focuses on advancements in semiconductor technology, contributing significantly to the industry through his innovative designs and methodologies.

Latest Patents: Among his latest inventions, Kelvin has developed two notable patents for integrated circuits (IC). The first patent features an IC with test structures and e-beam pads embedded within a contiguous standard cell area. This design includes a 4x3 e-beam pad that is compatible with advanced manufacturing processes, facilitating improved testing capabilities. This innovation is pivotal for ensuring the reliability and performance of modern semiconductor devices.

Career Highlights: Kelvin's extensive career in the semiconductor field has been marked by his tenure at Pdf Solutions, Incorporated, where he has played a crucial role in developing cutting-edge technologies. His consistent drive for innovation has not only enhanced product offerings but also solidified the company's reputation in the industry.

Collaborations: Throughout his career, Kelvin has worked closely with notable colleagues such as Stephen Lam and Dennis Ciplickas. These collaborations have fostered an environment of creativity and excellence, further contributing to the success of their projects and advancing the state of technology in their field.

Conclusion: Kelvin Doong's contributions to the semiconductor industry are profound, with his 82 patents reflecting his dedication to innovation and excellence. As he continues to push the boundaries of technology at Pdf Solutions, Incorporated, Kelvin stands as a leading figure in the field, inspiring future generations of inventors and engineers.

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