Kelvin Doong

This inventor holds 82 USPTO granted patents and 1 published patent application, primarily in Semiconductor Technology (CPC class H01L27-0207). Top assignee: Pdf Solutions, Incorporated. Active years: 2017-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kelvin Doong. Retrieved from https://idiyas.com/inventor/kelvin-doong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 82 (Patent Applications = 1)

% Patents Active = 4.9

Average Co-Inventor Count = 26.0

ph-index = 8

Forward Citations = 255(Granted Patents)

Forward Citations (Not Self Cited) = 202(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsinchu City, TW (2017)
Hsinchu, TW (2017 - 2021)

Company Filing History:

82 out of 203

Pdf Solutions, Incorporated

patents

Years Active: 2017-2021

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Areas of Expertise:

Integrated Circuit

Non-Contact Measurements

Electrical Measurements

Standard Cell

NCEM-Enabled Fill Cells

Tip-to-Side Short

Wafer Processing

Test Structures

Semiconductor Wafer

Via Open

Corner Short

Chamfer Short

82 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),

2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),

5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),

6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),

7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),

8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),

9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),

10. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),

11. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),

12. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),

13. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),

14. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),

15. 10199293 - Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas (2019-02-05),

Title: The Innovative Contributions of Kelvin Doong in the Semiconductor Industry

Introduction: Kelvin Doong is a prominent inventor based in Hsinchu, Taiwan, recognized for his impressive portfolio of 82 patents. His work primarily focuses on advancements in semiconductor technology, contributing significantly to the industry through his innovative designs and methodologies.

Latest Patents: Among his latest inventions, Kelvin has developed two notable patents for integrated circuits (IC). The first patent features an IC with test structures and e-beam pads embedded within a contiguous standard cell area. This design includes a 4x3 e-beam pad that is compatible with advanced manufacturing processes, facilitating improved testing capabilities. This innovation is pivotal for ensuring the reliability and performance of modern semiconductor devices.

Career Highlights: Kelvin's extensive career in the semiconductor field has been marked by his tenure at Pdf Solutions, Incorporated, where he has played a crucial role in developing cutting-edge technologies. His consistent drive for innovation has not only enhanced product offerings but also solidified the company's reputation in the industry.

Collaborations: Throughout his career, Kelvin has worked closely with notable colleagues such as Stephen Lam and Dennis Ciplickas. These collaborations have fostered an environment of creativity and excellence, further contributing to the success of their projects and advancing the state of technology in their field.

Conclusion: Kelvin Doong's contributions to the semiconductor industry are profound, with his 82 patents reflecting his dedication to innovation and excellence. As he continues to push the boundaries of technology at Pdf Solutions, Incorporated, Kelvin stands as a leading figure in the field, inspiring future generations of inventors and engineers.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: