IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Kazuhisa Arai

USPTO Granted Patents = 21 

Average Co-Inventor Count = 1.5

ph-index = 7

Forward Citations = 222(Granted Patents)


Location History:

  • Ota-ku, JP (2010 - 2014)
  • Tokyo, JP (2002 - 2017)

Company Filing History:

goldMedal21 out of 1,554 
 
Disco Corporation
 patents

Years Active: 2002-2017

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21 patents (USPTO):Explore Patents
1. 9627241 - Resin sheet attaching method (2017-04-18),
2. 9400423 - Manufacturing method for photomask (2016-07-26),
3. 8673743 - Wafer dividing method (2014-03-18),
4. 8142259 - Grinding machine and method (2012-03-27),
5. 7816264 - Wafer processing method (2010-10-19),
6. 7727810 - Wafer dividing method (2010-06-01),
7. 7704769 - Optical device manufacturing method (2010-04-27),
8. 7687375 - Lamination device manufacturing method (2010-03-30),
9. 7498239 - Wafer processing method (2009-03-03),
10. 7278206 - Method of preparing terminal board (2007-10-09),
11. 7222772 - Flip chip bonder (2007-05-29),
12. 7183178 - Method of manufacturing semiconductor wafer (2007-02-27),
13. 6927416 - Wafer support plate (2005-08-09),
14. 6759274 - Semiconductor chip pick-up method (2004-07-06),
15. 6702652 - Method of grinding rear side of semiconductor wafer (2004-03-09),

Title: The Innovative Contributions of Kazuhisa Arai

Introduction: Kazuhisa Arai, based in Tokyo, Japan, is a prominent inventor known for his significant contributions to the field of technology, particularly in the realm of manufacturing processes. With a remarkable portfolio of 21 patents, Arai has made strides that enhance industrial efficiency and product quality.

Latest Patents: Among Arai's latest innovations are two notable patents. The first is a "Resin Sheet Attaching Method," which focuses on attaching a resin sheet to a workpiece. This method includes a molecular weight reducing step that applies vacuum ultraviolet radiation to cut intermolecular bonds in the resin sheet, thus enhancing adhesive properties. The second patent, titled "Manufacturing Method for Photomask," outlines a technique for creating a photomask used in wafer processing. This process involves forming a groove on a light shielding plate and uniting it with a transparent plate through a light-transmitting bonding agent.

Career Highlights: Kazuhisa Arai is currently associated with Disco Corporation, where he utilizes his expertise to drive innovation and improve manufacturing techniques. His contributions not only highlight his inventive skills but also reflect the commitment of Disco Corporation to advance technology in the industry.

Collaborations: Arai has collaborated with esteemed coworkers like Hideyuki Sando and Masatoshi Nanjo. These collaborations demonstrate the importance of teamwork in fostering innovation and developing groundbreaking technologies.

Conclusion: Kazuhisa Arai continues to be a vital player in the world of invention, with his patents paving the way for future advancements in manufacturing. His innovative methods and collaborative spirit exemplify the essence of creativity and technology in a rapidly evolving industry.

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