The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Dec. 17, 2003
Applicants:
Kazuhisa Arai, Tokyo, JP;
Masatoshi Nanjo, Tokyo, JP;
Masahiko Kitamura, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Koichi Yajima, Tokyo, JP;
Inventors:
Kazuhisa Arai, Tokyo, JP;
Masatoshi Nanjo, Tokyo, JP;
Masahiko Kitamura, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Koichi Yajima, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/58 ; H01L029/04 ;
U.S. Cl.
CPC ...
Abstract
A wafer support plate comprises a support surface on which a semiconductor wafer is supported, and a crystal orientation mark which indicates the crystal orientation of the semiconductor wafer. Even the semiconductor wafer thinned by grinding can be stably held on the support surface, and the crystal orientation can be recognized even when the outer periphery of the semiconductor wafer has chipped.