The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Jul. 19, 2002
Kazuhisa Arai, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of grinding the rear side of a semiconductor wafer, the front side of which has bumps formed thereon, includes the steps of: preparing semiconductor wafers whose front surfaces have a plurality of circuits formed in their lattice patterns; coating the front side of a selected semiconductor wafer with a resist material to form a resist layer thereon; forming a plurality of holes in each section of the resist layer at which are to be formed bumps corresponding to the circuits by removing the resist; plating at the holes with a metal to form bumps; putting the semiconductor wafer on a selected chuck table with resist layer, which is formed on its front side, laid on the chuck table in a grinding machine; and grinding the rear side of the semiconductor wafer. The bumps are lower than the thickness of the resist layer, and therefore, they are short of reaching the front surface of the semiconductor wafer, and therefore, the semiconductor wafer can be protected from cracking, which otherwise would be caused by concentration of the stress to the bumps on the front side of the semiconductor wafer while grinding the rear side thereof.