The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Apr. 09, 2004
Kazuhisa Arai, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Hideyuki Sandoh, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Kazuhisa Arai, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Hideyuki Sandoh, Tokyo, JP;
Shinichi Namioka, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a chuck table, a semiconductor chip take-out area and an electrode cutting area, a cutting mechanism having a cutting tool for cutting the plurality of electrodes projecting from the front surface of the semiconductor chip held on the chuck table and arranged in the electrode cutting area to make them uniform in height, a semiconductor chip take-in mechanism, and a semiconductor chip conveying mechanism.