The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Jul. 08, 2014
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Kazuhisa Arai, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); C09J 5/02 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 38/0008 (2013.01); C09J 5/02 (2013.01); H01L 24/29 (2013.01); B32B 2037/0092 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/14 (2013.01); C09J 2205/31 (2013.01); C09J 2400/226 (2013.01); C09J 2400/228 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/12042 (2013.01);
Abstract
A resin sheet attaching method of attaching a resin sheet to a workpiece. The resin sheet attaching method includes a molecular weight reducing step of applying vacuum ultraviolet radiation to the front side of the resin sheet, thereby cutting an intermolecular bond in a surface region having a depth of tens of nanometers from the front side of the resin sheet to thereby reduce the molecular weight of the surface region and produce an adhesive force, and a resin sheet attaching step of attaching the front side of the resin sheet to the workpiece after performing the molecular weight reducing step.