logo

For the Inventor, By the Inventor

Yokohama, Japan

Katsuhiko Hieda

This inventor holds 76 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Manufacturing (CPC class H01L). Top assignees: Kabushiki Kaisha Toshiba, Fujitsu Corporation, Jsr Corporation. Active years: 1990-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsuhiko Hieda. Retrieved from https://idiyas.com/inventor/katsuhiko-hieda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 76 

% Patents Active = 71.1

 

Average Co-Inventor Count = 2.2

ph-index = 23

Forward Citations = 2,233(Granted Patents)

Forward Citations (Not Self Cited) = 2,212(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Wappingers Falls, NY (US) (1996 - 1998)
  • Kawasaki, JP (1999)
  • Kanagawa, JP (1995 - 2008)
  • Yokohama, JP (1990 - 2012)
  • Tokyo, JP (1993 - 2019)

Company Filing History:

goldMedal74 out of 53,262 
 
Kabushiki Kaisha Toshiba
 patents
silverMedal3 out of 39,374 
 
Fujitsu Corporation
 patents
bronzeMedal1 out of 1,078 
 
Jsr Corporation
 patents
4. 1 out of 19 
 
Siemens Microelectronics Limited
 patents
5. 1 out of 2,114 
 
Winbond Electronics Corporation
 patents
6. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1990-2019

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Device
Device Fabrication
Memory Technology
Capacitor Design
Trench Capacitor
3D Capacitor
Epitaxial Layers
Etching Method
Cleaning Method
Gas-Generating Film
Resin Composition
Dynamic Memory Device
76 patents (USPTO):Explore Patents
1. 10415011 - Adherend recovery method, adherend recovery apparatus, gas-generating film and resin composition (2019-09-17),
2. 8119196 - Semiconductor manufacturing apparatus, liquid container, and semiconductor device manufacturing method (2012-02-21),
3. 7759174 - Method of manufacturing a semiconductor device (2010-07-20),
4. 7618876 - Semiconductor device and method of manufacturing the same by filling a trench which includes an additional coating step (2009-11-17),
5. 7579241 - Semiconductor device and method of manufacture thereof (2009-08-25),
6. 7416987 - Semiconductor device and method of fabricating the same (2008-08-26),
7. 7413987 - Method for manufacturing a semiconductor device (2008-08-19),
8. 7253075 - Semiconductor device and method for manufacturing the same (2007-08-07),
9. 7224019 - Semiconductor device and method of manufacture thereof (2007-05-29),
10. 7180121 - Semiconductor device and method of manufacturing the same (2007-02-20),
11. 7112839 - Semiconductor device with transistor and capacitor and its manufacture method (2006-09-26),
12. 7105397 - Semiconductor device and method of fabricating the same (2006-09-12),
13. 7071107 - Method for manufacturing a semiconductor device (2006-07-04),
14. 7060559 - Method of manufacturing a nonvolatile semiconductor memory device (2006-06-13),
15. 6992358 - Semiconductor device and method for manufacturing the same (2006-01-31),

Title: Innovator Spotlight: Katsuhiko Hieda

Introduction

Katsuhiko Hieda, based in Yokohama, Japan, is an accomplished inventor with a remarkable portfolio that includes 76 patents. His contributions to the field, particularly in semiconductor manufacturing and adherend recovery methods, demonstrate his commitment to advancing technology and innovation.

Latest Patents

Hieda’s latest inventions include a method and apparatus for adherend recovery and innovations in semiconductor manufacturing. The adherend recovery method enables the extraction of adherends, such as cells, from a support structure through the generation of gas from a photosensitive layer. This innovative process allows for the effective separation of the stack from the support, facilitating the recovery of the adherend.

In addition, he has developed a semiconductor manufacturing apparatus that enhances efficiency by incorporating a discharge portion for applying coating liquids onto substrates while utilizing an inert gas to maintain pressure within the system. This technology also includes various connecting portions for liquid and solvent supply, showcasing his expertise in optimizing manufacturing processes.

Career Highlights

Throughout his career, Katsuhiko Hieda has contributed to renowned companies such as Toshiba Corporation and Fujitsu Corporation. His work within these leading technology firms has provided him with a platform to innovate and develop groundbreaking technologies that have shaped the industry.

Collaborations

Hieda has collaborated with notable coworkers including Akihiro Nitayama and Fumio Horiguchi, reflecting a strong network of talented professionals who share his vision for technological advancement. These collaborations have further propelled his innovative endeavors.

Conclusion

In summary, Katsuhiko Hieda’s extensive contributions to the field of semiconductor manufacturing and adherend recovery showcase his innovative spirit and dedication as an inventor. With a significant number of patents to his name, his work continues to influence the next generation of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…