Suwon, South Korea

Junwoo Park

This inventor holds 16 USPTO granted patents and 14 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junwoo Park. Retrieved from https://idiyas.com/inventor/junwoo-park-aoj96p9x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.5

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Suwon-si, KR (2019 - 2021)
  • Gyeonggi-do, KR (2023)

Company Filing History:


Years Active: 2019-2026

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Areas of Expertise:
Chip Interposer
Electromagnetic Shielding
Package-on-Package
Molded Product
Network Lock Function
Authentication Method
Fixing Members
Package Substrate
16 patents (USPTO):Explore Patents

Title: **Innovator Profile: Junwoo Park - A Pioneer in Electronic Device Technologies**

Introduction

Junwoo Park is an accomplished inventor based in Suwon-si, South Korea, with a significant track record of six patents to his name. His work primarily revolves around the development of advanced electronic devices, particularly focusing on improving technology infrastructure in a digital age. Today, we explore some of his latest innovations and contributions in the field.

Latest Patents

Among Junwoo Park's latest patents are two notable inventions:

1. **Method of setting up network lock function of electronic device and electronic device using the same**: This patent describes an advanced electronic device comprising a communication module, a subscriber identification module, and at least one processor. The device is designed to identify the identification information stored in the subscriber module upon initial insertion, configure the network service provider accordingly, and generate a security signature using lock information. Importantly, it also includes a function to set up a network lock based on identified network lock information.

2. **Semiconductor package having package substrate**: This patent outlines a semiconductor package consisting of a package substrate with a communication hole that extends from the top to the bottom surface. It features a semiconductor chip and an auxiliary chip, along with external connection terminals, all of which are encapsulated for enhanced efficiency and connectivity.

Career Highlights

Junwoo Park works for Samsung Electronics Co., Ltd., a leading global innovator in technology and electronics. His role at the company allows him to contribute to significant advancements in electronic device technology. With a robust career, he has played a pivotal role in the development of technologies that streamline communication processes across devices, reinforcing Samsung's position in the market.

Collaborations

Throughout his career, Junwoo has collaborated with other talented inventors, including colleagues Hyunki Kim and Pyoungwan Kim. These collaborations have led to a synergistic enhancement of their respective projects, further pushing the boundaries of innovation within the electronic devices sector.

Conclusion

In conclusion, Junwoo Park’s innovative contributions to technology, particularly in network functions and semiconductor packaging, highlight his role as a key player in advancing electronic device capabilities. With multiple patents and a strong collaborative spirit, he continues to impact the field, paving the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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