The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Feb. 17, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sunchul Kim, Suwon-si, KR;
Junwoo Park, Suwon-si, KR;
Hyunggil Baek, Suwon-si, KR;
Yongkwan Lee, Suwon-si, KR;
Juhyung Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a lower substrate; a semiconductor chip disposed on the lower substrate; an upper substrate disposed on the semiconductor chip, having a lower surface facing the semiconductor chip, and including step structures disposed below the lower surface; a connection structure disposed around the semiconductor chip and connecting the lower substrate to the upper substrate; and an encapsulant filling a space between the lower substrate and the upper substrate and sealing at least a portion of each of the semiconductor chip and the connection structure. The lower surface of the upper substrate has a first surface portion on which the step structures are disposed and a second surface portion having a step with respect to the lower surface of the step structures, and the second surface portion extends between opposite edges of the upper substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile