Hyunggil Baek is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work has been instrumental in advancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of Baek's latest patents is focused on semiconductor packages that incorporate fixing members. This innovative design includes an interposer with an upper pad and a passivation layer, a semiconductor chip, and a conductor pattern. The package also features a guide pattern with a main opening and sub-openings, along with a support structure that enhances stability. Another notable patent involves a method for manufacturing semiconductor packages, which outlines a process that includes providing a substrate with cutting regions and a mounting area for semiconductor chips. This method aims to streamline the production of semiconductor packages while ensuring high quality.

Career Highlights

Baek's career at Samsung Electronics Co., Ltd. has been marked by his dedication to research and development in semiconductor technology. His innovative approaches have led to advancements that benefit both the company and the broader technology sector. His expertise in semiconductor packaging has positioned him as a key figure in the industry.

Collaborations

Throughout his career, Baek has collaborated with talented individuals such as Yongkwan Lee and Seunghwan Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Hyunggil Baek's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor packaging, showcasing the importance of innovation in technology.

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