The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Sep. 13, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyoeun Lee, Suwon-si, KR;
Hyunggil Baek, Suwon-si, KR;
Su-Chang Lee, Suwon-si, KR;
Gyunghwan Oh, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate including a first region having a recess defined therein and a second region spaced apart from the first region. The second region does not include the recess. A three-dimensional (3D) integrated circuit structure is on the first region. The 3D integrated circuit structure includes a first semiconductor chip die and a second semiconductor chip die disposed on the first semiconductor chip die. A plurality of connecting members electrically connecting the first semiconductor chip die to the substrate. A first side of each connecting member of the plurality of connecting members directly contacts the first semiconductor chip die and a second side that is opposite to the first side directly contacts the first region. A memory structure is disposed in the second region and positioned side by side with the 3D integrated circuit structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile