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For the Inventor, By the Inventor

Seoul, South Korea

Su-Chang Lee

This inventor holds 8 USPTO granted patents and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Su-Chang Lee. Retrieved from https://idiyas.com/inventor/su-chang-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 75.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 48(Granted Patents)


Company Filing History:

goldMedal8 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2011-2017

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8 patents (USPTO):Explore Patents
1. 9698088 - Semiconductor packages (2017-07-04),
2. 9601458 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2017-03-21),
3. 9048168 - Semiconductor packages having warpage compensation (2015-06-02),
4. 9040351 - Stack packages having fastening element and halogen-free inter-package connector (2015-05-26),
5. 8716872 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2014-05-06),
6. 8604614 - Semiconductor packages having warpage compensation (2013-12-10),
7. 8546954 - Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package (2013-10-01),
8. 7868443 - Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability (2011-01-11),

Title: Su-Chang Lee: Innovator in Semiconductor Technology

Introduction

Su-Chang Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

Among his latest patents, Su-Chang Lee has developed advanced semiconductor packages. These packages include a first substrate with a central portion and a peripheral portion, featuring at least one first central connection member attached to the central portion. The first central connection member consists of a first supporter and a first fusion conductive layer surrounding the supporter. Additionally, he has created a stacked semiconductor package that includes connections electrically linking first and second semiconductor packages. This design allows for improved integration and functionality in semiconductor applications.

Career Highlights

Su-Chang Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs and patents have positioned him as a key player in the industry.

Collaborations

Throughout his career, Su-Chang Lee has collaborated with notable colleagues, including Heung-Kyu Kwon and Hyon-chol Kim. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Su-Chang Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of electronics and semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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