The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Apr. 21, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Heungkyu Kwon, Seongnam-si, KR;
Kang Joon Lee, Yongsin-si, KR;
JaeWook Yoo, Suwon-si, KR;
Su-Chang Lee, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/488 (2006.01); H01L 23/16 (2006.01); H01L 23/18 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/16 (2013.01); H01L 23/18 (2013.01); H01L 23/3157 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 23/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1366 (2013.01); H01L 2224/1367 (2013.01); H01L 2224/1368 (2013.01); H01L 2224/13541 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/13583 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13616 (2013.01); H01L 2224/13624 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13649 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/13669 (2013.01); H01L 2224/13671 (2013.01); H01L 2224/13672 (2013.01); H01L 2224/13679 (2013.01); H01L 2224/13681 (2013.01); H01L 2224/13684 (2013.01); H01L 2224/1401 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/175 (2013.01); H01L 2224/1712 (2013.01); H01L 2224/1751 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1082 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.