The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Jul. 24, 2014
Samsung Electronics Co., Ltd, Suwon-si, Gyeonggi-do, KR;
Heung-Kyu Kwon, Seongnam-si, KR;
Jae-Wook Yoo, Suwon-si, KR;
Hyon-Chol Kim, Hwaseong-si, KR;
Su-Chang Lee, Seoul, KR;
Min-Ok Na, Bucheon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.