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For the Inventor, By the Inventor

Seongnam-si, South Korea

Heung-Kyu Kwon

USPTO Granted Patents = 34 

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 258(Granted Patents)


Location History:

  • Kyungki-do, KR (2003 - 2010)
  • Gyeonggi-do, KR (2008 - 2010)
  • Suwon-si, KR (2009 - 2010)
  • Seongnam-si, KR (2008 - 2020)

Company Filing History:

goldMedal34 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2003-2020

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34 patents (USPTO):Explore Patents
1. 10593652 - Stacked semiconductor packages (2020-03-17),
2. 10403606 - Method of fabricating a semiconductor package (2019-09-03),
3. 10056321 - Semiconductor package and method for routing the package (2018-08-21),
4. 9978721 - Apparatus for stacked semiconductor packages and methods of fabricating the same (2018-05-22),
5. 9601458 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2017-03-21),
6. 9048168 - Semiconductor packages having warpage compensation (2015-06-02),
7. 9042115 - Stacked semiconductor packages (2015-05-26),
8. 9040351 - Stack packages having fastening element and halogen-free inter-package connector (2015-05-26),
9. 8981581 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2015-03-17),
10. 8963308 - Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device (2015-02-24),
11. 8817486 - Semiconductor package having multi pitch ball land (2014-08-26),
12. 8716872 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2014-05-06),
13. 8698301 - Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device (2014-04-15),
14. 8680667 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2014-03-25),
15. 8618671 - Semiconductor packages having passive elements mounted thereonto (2013-12-31),

Title: Heung-Kyu Kwon: Innovating Semiconductor Technologies

Introduction: Heung-Kyu Kwon, based in Seongnam-si, South Korea, is a notable inventor recognized for his substantial contributions to semiconductor technologies. With a remarkable portfolio of 34 patents, Kwon has proven himself as a leading innovator in the field, particularly within Samsung Electronics Co., Ltd.

Latest Patents: Among his latest innovations are patents for stacked semiconductor packages and methods of fabricating semiconductor packages. The stacked semiconductor package patent describes an apparatus featuring a first substrate with a first land and a second substrate with a second land. Key elements include a first molding compound placed between the substrates, a first semiconductor chip mounted on the first substrate in contact with the molding portion, and specialized connectors that facilitate electrical connections.

His method of fabricating a semiconductor package outlines a process that involves mounting a semiconductor chip on a substrate, using a molding control film, and connecting additional semiconductor chips via a second substrate. This method emphasizes precise control over the molding compound to enhance the integration of semiconductor components.

Career Highlights: Heung-Kyu Kwon’s career at Samsung Electronics Co., Ltd. has been marked by a continuous push for innovation in the semiconductor space. His work has not only advanced technology but also contributed to Samsung's reputation as a leader in the electronics industry.

Collaborations: During his time at Samsung, Kwon has collaborated with talented individuals such as Tae-Hun Kim and Su-Chang Lee. These collaborations reflect the importance of teamwork in achieving groundbreaking technology in semiconductor development.

Conclusion: Heung-Kyu Kwon's dedication to his craft and his impressive patent portfolio solidify his standing as a key player in the semiconductor industry. His innovative work continues to pave the way for future advancements in technology, ensuring that Samsung Electronics remains at the forefront of semiconductor development.

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