Heung-Kyu Kwon

This inventor holds 34 USPTO granted patents and 7 published patent applications, primarily in Stacked Semiconductor Packages. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heung-Kyu Kwon. Retrieved from https://idiyas.com/inventor/heung-kyu-kwon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 (Patent Applications = 7)

% Patents Active = 91.2

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 259(Granted Patents)

Location History:

Kyungki-do, KR (2003 - 2010)
Gyeonggi-do, KR (2008 - 2010)
Suwon-si, KR (2009 - 2010)
Seongnam-si, KR (2008 - 2020)

Company Filing History:

34 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2003-2020

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Areas of Expertise:

Stacked Semiconductor Packages

Fabrication Methods

Warpage Compensation

Multi-Chip Designs

Ball Grid Array

Interposer Chip

Electrical Connections

Package Substrates

Asymmetric Conductive Elements

Heat Spreader

Digital Devices

Passive Elements

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10593652 - Stacked semiconductor packages (2020-03-17),

2. 10403606 - Method of fabricating a semiconductor package (2019-09-03),

3. 10056321 - Semiconductor package and method for routing the package (2018-08-21),

4. 9978721 - Apparatus for stacked semiconductor packages and methods of fabricating the same (2018-05-22),

5. 9601458 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2017-03-21),

6. 9048168 - Semiconductor packages having warpage compensation (2015-06-02),

7. 9042115 - Stacked semiconductor packages (2015-05-26),

8. 9040351 - Stack packages having fastening element and halogen-free inter-package connector (2015-05-26),

9. 8981581 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2015-03-17),

10. 8963308 - Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device (2015-02-24),

11. 8817486 - Semiconductor package having multi pitch ball land (2014-08-26),

12. 8716872 - Stacked semiconductor package including connections electrically connecting first and second semiconductor packages (2014-05-06),

13. 8698301 - Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device (2014-04-15),

14. 8680667 - Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements (2014-03-25),

15. 8618671 - Semiconductor packages having passive elements mounted thereonto (2013-12-31),

Title: Heung-Kyu Kwon: Innovating Semiconductor Technologies

Introduction: Heung-Kyu Kwon, based in Seongnam-si, South Korea, is a notable inventor recognized for his substantial contributions to semiconductor technologies. With a remarkable portfolio of 34 patents, Kwon has proven himself as a leading innovator in the field, particularly within Samsung Electronics Co., Ltd.

Latest Patents: Among his latest innovations are patents for stacked semiconductor packages and methods of fabricating semiconductor packages. The stacked semiconductor package patent describes an apparatus featuring a first substrate with a first land and a second substrate with a second land. Key elements include a first molding compound placed between the substrates, a first semiconductor chip mounted on the first substrate in contact with the molding portion, and specialized connectors that facilitate electrical connections.

His method of fabricating a semiconductor package outlines a process that involves mounting a semiconductor chip on a substrate, using a molding control film, and connecting additional semiconductor chips via a second substrate. This method emphasizes precise control over the molding compound to enhance the integration of semiconductor components.

Career Highlights: Heung-Kyu Kwon’s career at Samsung Electronics Co., Ltd. has been marked by a continuous push for innovation in the semiconductor space. His work has not only advanced technology but also contributed to Samsung's reputation as a leader in the electronics industry.

Collaborations: During his time at Samsung, Kwon has collaborated with talented individuals such as Tae-Hun Kim and Su-Chang Lee. These collaborations reflect the importance of teamwork in achieving groundbreaking technology in semiconductor development.

Conclusion: Heung-Kyu Kwon's dedication to his craft and his impressive patent portfolio solidify his standing as a key player in the semiconductor industry. His innovative work continues to pave the way for future advancements in technology, ensuring that Samsung Electronics remains at the forefront of semiconductor development.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: