The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2013

Filed:

Oct. 14, 2010
Applicants:

Heung-kyu Kwon, Seongnam-si, KR;

Hyung-jun Lim, Suwon-si, KR;

Byeong-yeon Cho, Suwon-si, KR;

Inventors:

Heung-kyu Kwon, Seongnam-si, KR;

Hyung-Jun Lim, Suwon-si, KR;

Byeong-yeon Cho, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package onto which a plurality of passive elements is mounted. A substrate includes a first surface and a second surface. A semiconductor chip is on one of the first surface and the second surface of the substrate. A plurality of passive elements are on the substrate. The plurality of passive elements include a plurality of first passive elements and a plurality of second passive elements that are taller than the plurality of first passive elements. The plurality of first passive elements are on at least one of the first surface and the second surface, and at least two of the plurality of second passive elements are on the second surface.


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