IDiyas

For the Inventor, By the Inventor

Bucheon-si, South Korea

Min-Ok Na

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 79(Granted Patents)


Company Filing History:

goldMedal13 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2013-2021

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13 patents (USPTO):Explore Patents
1. 10950521 - Thermal interface material layer and package-on-package device including the same (2021-03-16),
2. 10593652 - Stacked semiconductor packages (2020-03-17),
3. 10431522 - Thermal interface material layer and package-on-package device including the same (2019-10-01),
4. 10403606 - Method of fabricating a semiconductor package (2019-09-03),
5. 9978721 - Apparatus for stacked semiconductor packages and methods of fabricating the same (2018-05-22),
6. 9899294 - Thermal interface material layer and package-on-package device including the same (2018-02-20),
7. 9214484 - Image sensor packages (2015-12-15),
8. 9042115 - Stacked semiconductor packages (2015-05-26),
9. 9040351 - Stack packages having fastening element and halogen-free inter-package connector (2015-05-26),
10. 8829686 - Package-on-package assembly including adhesive containment element (2014-09-09),
11. 8709879 - Method of forming a semiconductor package (2014-04-29),
12. 8508954 - Systems employing a stacked semiconductor package (2013-08-13),
13. 8426959 - Semiconductor package and method of manufacturing the same (2013-04-23),

Title: Innovator Spotlight: Min-Ok Na

Introduction

Min-Ok Na, a prolific inventor based in Bucheon-si, South Korea, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 13 patents, he has demonstrated a commitment to advancing innovation within the industry.

Latest Patents

Among his latest patents are two notable inventions: a thermal interface material layer and a package-on-package device that incorporates this layer. The thermal interface material layer is designed to improve the reliability of semiconductor packages by preventing cracks during the solder ball joint process. This advancement is critical in maintaining the integrity of lower semiconductor chips during assembly.

Additionally, Na's patent for stacked semiconductor packages details an innovative apparatus featuring a first and second substrate, each having distinct lands. The design allows for efficient connection and enhanced exposure of the semiconductor chip, revolutionizing the way stacked configurations are constructed and utilized in technology.

Career Highlights

Min-Ok Na is currently affiliated with Samsung Electronics Co., Ltd., where his expertise continues to drive innovations in semiconductor design and manufacturing processes. His role at Samsung has allowed him to explore numerous facets of electronics, contributing to the company's reputation as a leader in the global tech market.

Collaborations

Throughout his career, Min-Ok Na has collaborated with talented individuals such as Ji-Hyun Park and Heung-Kyu Kwon. These partnerships have fostered an environment of creativity and innovation, resulting in solutions that address complex challenges in semiconductor technology.

Conclusion

Min-Ok Na's contributions to the semiconductor industry exemplify the impact of dedicated inventors on technological progress. With his extensive patent portfolio and collaborative spirit, Na continues to pave the way for future innovations at Samsung Electronics Co., Ltd. His inventions not only enhance product performance but also inspire upcoming generations of engineers and inventors in the field.

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