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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9899294 B1

PDFFull Text
Date of Patent:
Feb. 20, 2018

Filed:

Aug. 12, 2013

Thermal interface material layer and package-on-package device including the same

Applicants:

Min-ok NA, Bucheon-si, KR;

Jongkook Kim, Hwaseong-si, KR;

Hyo-chang Ryu, Cheonan-si, KR;

Jin-woo Park, Seoul, KR;

Bongjin Son, Asan-si, KR;

Jangwoo Lee, Seoul, KR;

Inventors:

Min-Ok Na, Bucheon-si, KR;

Jongkook Kim, Hwaseong-si, KR;

Hyo-Chang Ryu, Cheonan-si, KR;

Jin-woo Park, Seoul, KR;

BongJin Son, Asan-si, KR;

Jangwoo Lee, Seoul, KR;

Assignee:

Samsung Electronics co., Ltd., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 21/563 (2013.01); H01L 23/367 (2013.01); H01L 25/065 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92225 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

Provided are a thermal interface material layer and a package-on-package device including the same. The package-on-package device may include a thermal interface material layer interposed between lower and upper semiconductor packages and configured to have a specific physical property. Accordingly, it is possible to prevent a crack from occurring in a lower semiconductor chip, when a solder ball joint process is performed to mount the upper semiconductor package on the lower semiconductor package.

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