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For the Inventor, By the Inventor

Cheonan, South Korea

Hyo-Chang Ryu

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyo-Chang Ryu. Retrieved from https://idiyas.com/inventor/hyo-chang-ryu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 22(Granted Patents)


Location History:

  • Asan-si, KR (2014)
  • Cheonan-si, KR (2018 - 2023)
  • Suwon-si, KR (2023)

Company Filing History:

goldMedal8 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2023

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8 patents (USPTO):Explore Patents
1. 11721679 - Semiconductor package and method of fabricating the same (2023-08-08),
2. 11670565 - Semiconductor package with heat dissipation member (2023-06-06),
3. 11217503 - Semiconductor package having logic semiconductor chip and memory packages on interposer (2022-01-04),
4. 11145637 - Semiconductor package including a substrate having two silicon layers formed on each other (2021-10-12),
5. 10950521 - Thermal interface material layer and package-on-package device including the same (2021-03-16),
6. 10431522 - Thermal interface material layer and package-on-package device including the same (2019-10-01),
7. 9899294 - Thermal interface material layer and package-on-package device including the same (2018-02-20),
8. 8829686 - Package-on-package assembly including adhesive containment element (2014-09-09),

Title: Hyo-Chang Ryu: Innovator in Semiconductor Technology

Introduction

Hyo-Chang Ryu is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

Among his latest patents is a semiconductor package and method of fabricating the same. This invention includes a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The design features a first base layer, a second base layer, circuit patterns, and an integrated device embedded in the first base layer. Another notable patent is a semiconductor package with a heat dissipation member. This package includes a first substrate, two chip structures, and a heat dissipation member that effectively manages thermal performance.

Career Highlights

Hyo-Chang Ryu is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs have contributed to the advancement of electronic devices, making them more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Min-Ok Na and Yun Seok Choi, to further enhance the development of semiconductor technologies.

Conclusion

Hyo-Chang Ryu's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His inventions are paving the way for future advancements in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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