Hyo-Chang Ryu

Title: Hyo-Chang Ryu: Innovator in Semiconductor Technology

Introduction

Hyo-Chang Ryu is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

Among his latest patents is a semiconductor package and method of fabricating the same. This invention includes a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The design features a first base layer, a second base layer, circuit patterns, and an integrated device embedded in the first base layer. Another notable patent is a semiconductor package with a heat dissipation member. This package includes a first substrate, two chip structures, and a heat dissipation member that effectively manages thermal performance.

Career Highlights

Hyo-Chang Ryu is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs have contributed to the advancement of electronic devices, making them more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Min-Ok Na and Yun Seok Choi, to further enhance the development of semiconductor technologies.

Conclusion

Hyo-Chang Ryu's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His inventions are paving the way for future advancements in electronic devices.