The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Aug. 04, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Ok-Gyeong Park, Yongin-si, KR;

Min-Ok Na, Bucheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01);
Abstract

An image sensor package may include: a package substrate including a chip attachment area on an upper surface thereof, a pad area having a plurality of pads around the chip attachment area, and a holder attachment area at an outside of the pad area, wherein an upper surface of the holder attachment area is at a lower level than an upper surface of the pad area; an image sensor chip mounted on the chip attachment area of the package substrate; a transparent member above the package substrate and configured to cover the image sensor chip; and a holder on the holder attachment area of the package substrate and configured to fix the transparent member.


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