The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Mar. 19, 2010
Hyunggil Baek, Suwon-si, KR;
Hyunggil Baek, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A packaged integrated circuit device includes a primary chip stack and a secondary chip stack. The primary chip stack includes memory chips therein that define a logical package addressable by a memory controller. The secondary chip stack includes fewer memory chips than the primary chip stack. The memory chips of the secondary chip stack are configured to be electrically connected to memory chips of at least one external device package to define an additional logical package addressable by the memory controller. The additional logical package may include a same number of memory chips as the primary chip stack.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile