The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Nov. 30, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kanggyune Lee, Suwon-si, KR;

Hyunggil Baek, Suwon-si, KR;

Youngja Kim, Cheonan-si, KR;

Seungjin Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H01L 25/10 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0269 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H01L 25/105 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1082 (2013.01); H05K 1/113 (2013.01); H05K 2201/09936 (2013.01);
Abstract

A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.


Find Patent Forward Citations

Lee, Kanggyune. (2026). Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same (U.S. Patent No. 12557209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12557209

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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