Suwon, South Korea

Kanggyune Lee

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kanggyune Lee. Retrieved from https://idiyas.com/inventor/kanggyune-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 33.3

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Kanggyune Lee: Innovator in Printed Circuit Board Technology

Introduction

Kanggyune Lee is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of electronics, particularly in the design and functionality of printed circuit boards. His innovative work has led to the development of a patented technology that enhances the efficiency and reliability of semiconductor packages.

Latest Patents

Kanggyune Lee holds a patent for a "Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same." This invention includes a substrate base with a plurality of ball lands arranged on its surface. It features a cutting position identification mark located at a corner of the substrate base and at least one alignment mark that is spaced apart from the ball lands. Notably, the top surfaces of the ball lands and the alignment mark are at substantially the same vertical level, ensuring compatibility and functionality.

Career Highlights

Kanggyune Lee is currently employed at Samsung Electronics Ltd., a leading global technology company. His role involves research and development in electronic components, where he applies his expertise to create innovative solutions that meet the demands of modern technology.

Collaborations

Kanggyune Lee has collaborated with his coworker, Hyunggil Baek, to further enhance the development of their patented technologies. Their teamwork exemplifies the collaborative spirit that drives innovation in the tech industry.

Conclusion

Kanggyune Lee's contributions to printed circuit board technology reflect his dedication to innovation and excellence in the field of electronics. His patent demonstrates a significant advancement that could influence future developments in semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…