This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Kanggyune Lee: Innovator in Printed Circuit Board Technology
Introduction
Kanggyune Lee is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of electronics, particularly in the design and functionality of printed circuit boards. His innovative work has led to the development of a patented technology that enhances the efficiency and reliability of semiconductor packages.
Latest Patents
Kanggyune Lee holds a patent for a "Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same." This invention includes a substrate base with a plurality of ball lands arranged on its surface. It features a cutting position identification mark located at a corner of the substrate base and at least one alignment mark that is spaced apart from the ball lands. Notably, the top surfaces of the ball lands and the alignment mark are at substantially the same vertical level, ensuring compatibility and functionality.
Career Highlights
Kanggyune Lee is currently employed at Samsung Electronics Ltd., a leading global technology company. His role involves research and development in electronic components, where he applies his expertise to create innovative solutions that meet the demands of modern technology.
Collaborations
Kanggyune Lee has collaborated with his coworker, Hyunggil Baek, to further enhance the development of their patented technologies. Their teamwork exemplifies the collaborative spirit that drives innovation in the tech industry.
Conclusion
Kanggyune Lee's contributions to printed circuit board technology reflect his dedication to innovation and excellence in the field of electronics. His patent demonstrates a significant advancement that could influence future developments in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile