The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jun. 16, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 46/00 (2026.01); H10W 40/10 (2026.01); H10W 74/10 (2026.01); H10W 72/20 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01); H10W 90/24 (2026.01);
U.S. Cl.
CPC ...
H10W 46/607 (2026.01); H10W 40/10 (2026.01); H10W 46/00 (2026.01); H10W 46/401 (2026.01); H10W 74/117 (2026.01); H10W 72/20 (2026.01); H10W 74/014 (2026.01); H10W 90/00 (2026.01); H10W 90/24 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a first marking pattern in or on the first inclined surface of the sealing layer.
Lee, Kanggyune. (2026). Semiconductor package (U.S. Patent No. 12702019). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12702019
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile