The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Feb. 14, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongkwan Lee, Hwaseong-si, KR;
Seunghwan Kim, Anyang-si, KR;
Jungjoo Kim, Hwaseong-si, KR;
Jongwan Kim, Cheonan-si, KR;
Hyunki Kim, Anyang-si, KR;
Junwoo Park, Anyang-si, KR;
Hyunggil Baek, Suwon-si, KR;
Junga Lee, Cheonan-si, KR;
Taejun Jeon, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate having a communication hole extending from an upper surface of the package substrate to a lower surface of the package substrate, a semiconductor chip attached to the upper surface of the package substrate, an auxiliary chip attached to the lower surface of the package substrate, external connection terminals attached to the lower surface of the package substrate and spaced apart from the auxiliary chip, and an encapsulant encapsulating the semiconductor chip and the auxiliary chip and filling the communication hole.