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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10622340 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Nov. 20, 2017

Semiconductor package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;

Inventors:

Chanhee Jeong, Chungcheongnam-Do, KR;

Hyunki Kim, Chungcheongnam-Do, KR;

Junwoo Park, Suwon-si, KR;

Byoung Wook Jang, Chungcheongnam-Do, KR;

Sunchul Kim, Chungcheongnam-Do, KR;

Su-Min Park, Suwon-si, KR;

Pyoungwan Kim, Suwon-si, KR;

Inku Kang, Hwaseong-si, KR;

Heeyeol Kim, Chungcheongnam-Do, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:

Volentine, Whitt & Francos, PLLC

Primary Examiner:

Vincent Wall

Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/214 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A semiconductor package includes a semiconductor chip disposed on a first substrate, a mold layer covering a sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal disposed between the first substrate and the second substrate and provided in the through-hole, and an underfill resin layer extending from between the semiconductor chip and the second substrate into the through-hole.

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