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For the Inventor, By the Inventor

Ansan-si, South Korea

Su-Min Park

USPTO Granted Patents = 18 

Average Co-Inventor Count = 5.9

ph-index = 4

Forward Citations = 82(Granted Patents)


Location History:

  • Seoul, KR (2013 - 2017)
  • Ansan-si, KR (2013 - 2020)
  • Suwon-si, KR (2020 - 2021)

Company Filing History:

goldMedal16 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal3 out of 787 
 
Cheil Industries Inc.
 patents
where one patent can have more than one assignee

Years Active: 2013-2021

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18 patents (USPTO):
1. 11133296 - Semiconductor package (2021-09-28),
2. 10622340 - Semiconductor package (2020-04-14),
3. 10593652 - Stacked semiconductor packages (2020-03-17),
4. 10403606 - Method of fabricating a semiconductor package (2019-09-03),
5. 9978721 - Apparatus for stacked semiconductor packages and methods of fabricating the same (2018-05-22),
6. 9837272 - Methods of manufacturing semiconductor devices (2017-12-05),
7. 9773672 - Method of forming micropatterns (2017-09-26),
8. 9570304 - Method of forming fine patterns in an anti-reflection layer for use as a patterning hard mask (2017-02-14),
9. 9370098 - Package substrates and integrated circuit packages including the same (2016-06-14),
10. 9252095 - Semiconductor package and method of fabricating the same (2016-02-02),
11. 9042115 - Stacked semiconductor packages (2015-05-26),
12. 8975110 - Methods of forming a passivation layer (2015-03-10),
13. 8697320 - Phenol compounds and positive photosensitive resin composition including the same (2014-04-15),
14. 8623743 - Semiconductor chips having guard rings and methods of fabricating the same (2014-01-07),
15. 8592131 - Ortho-nitrobenzyl ester compound and positive type photosensitive resin composition including the same (2013-11-26),

Title: The Innovative Contributions of Su-Min Park

Introduction

Su-Min Park is a prominent inventor based in Ansan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 18 patents. His work has been instrumental in advancing the design and functionality of semiconductor packages.

Latest Patents

Among his latest patents, Su-Min Park has developed a semiconductor package that includes a semiconductor chip disposed on a first substrate. This innovative package features a mold layer covering the sidewall of the semiconductor chip, which includes a through-hole. Additionally, a second substrate is disposed on the semiconductor chip, with a connection terminal located between the first and second substrates, provided in the through-hole. An underfill resin layer extends from between the semiconductor chip and the second substrate into the through-hole, enhancing the package's reliability and performance.

Career Highlights

Su-Min Park has had a distinguished career, working with leading companies in the technology sector. He has been associated with Samsung Electronics Co., Ltd. and Cheil Industries Inc., where he has contributed to various projects and innovations in semiconductor technology.

Collaborations

Throughout his career, Su-Min Park has collaborated with notable colleagues, including Heung-Kyu Kwon and Min-Ok Na. These collaborations have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Su-Min Park's innovative work in semiconductor technology and his impressive portfolio of patents highlight his significant impact on the industry. His contributions continue to shape the future of semiconductor packaging and technology.

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