The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jun. 20, 2013
Jongkook Kim, Hwaseong-si, KR;
Su-min Park, Ansan-si, KR;
Soojeoung Park, Hwaseong-si, KR;
Bona Baek, Yongin-si, KR;
Hohyeuk Im, Seoul, KR;
Byoungwook Jang, Hwaseong-si, KR;
Yoonha Jung, Suwon-si, KR;
Jongkook Kim, Hwaseong-si, KR;
Su-min Park, Ansan-si, KR;
Soojeoung Park, Hwaseong-si, KR;
Bona Baek, Yongin-si, KR;
Hohyeuk Im, Seoul, KR;
Byoungwook Jang, Hwaseong-si, KR;
Yoonha Jung, Suwon-si, KR;
Samsung Electronics Co., LTD., Gyeonggi-do, KR;
Abstract
Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.