The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Mar. 23, 2011
Applicants:
Soo-young Kim, Seongnam-si, KR;
Chang-ho Lee, Suwon-si, KR;
Su-min Park, Seoul, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 21/02 (2006.01); C08G 73/10 (2006.01); C08G 73/22 (2006.01); C09D 179/08 (2006.01); G03F 7/023 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02118 (2013.01); C08G 73/10 (2013.01); C08G 73/1085 (2013.01); C08G 73/22 (2013.01); C09D 179/08 (2013.01); G03F 7/0233 (2013.01); G03F 7/40 (2013.01); H01L 21/02282 (2013.01);
Abstract
In a composition of forming a passivation layer, the composition includes about 30 to about 60 percent by weight of a mixed polymer resin formed by blending polyamic acid and polyhydroxy amide, about 3 to about 10 percent by weight of a photoactive compound, about 2 to about 10 percent by weight of a cross-linking agent and an organic solvent. The passivation layer formed by using the composition has superior mechanical and physical properties, in which disadvantages of polyimide and polybenzoxazole are compensated by mixing both materials.