Company Filing History:
Years Active: 2020-2021
Title: Innovator Spotlight: Heeyeol Kim and His Contributions to Semiconductor Packaging
Introduction: Heeyeol Kim, an accomplished inventor based in Chungcheongnam-do, South Korea, has made significant strides in the field of semiconductor packaging. With a total of two patents to his name, Kim's innovations reflect the rapidly evolving demands of modern electronic devices.
Latest Patents: Kim's latest inventions focus on enhancing semiconductor packages. One of his patents details a semiconductor package that consists of a semiconductor chip placed on a first substrate. This design includes a mold layer that covers the sidewall of the chip, featuring a through-hole to improve connectivity. It also incorporates a second substrate positioned above the chip, a connection terminal located between the two substrates, and an underfill resin layer that extends into the through-hole, ensuring a sturdy and reliable structure.
Career Highlights: Currently working at Samsung Electronics Co., Ltd., Heeyeol Kim plays a pivotal role in advancing semiconductor technologies. His expertise in package design contributes significantly to the company's ongoing innovations and product offerings.
Collaborations: At Samsung Electronics, Kim collaborates with talented professionals such as Chanhee Jeong and Hyunki Kim. Together, they push the boundaries of what is possible in semiconductor packaging, ensuring that their developments meet the industry's rigorous standards for performance and reliability.
Conclusion: Heeyeol Kim stands out as a leading figure in the semiconductor packaging sector. Through his patents and collaborative efforts, he continues to impact the technology landscape positively, reinforcing the significance of innovative designs in modern electronics.