Inku Kang

Title: Inku Kang: Innovator in Semiconductor Packaging

Introduction

Inku Kang is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

Inku Kang's latest patents focus on advanced semiconductor packages. The first patent describes a semiconductor package that includes a semiconductor chip disposed on a first substrate, a mold layer covering the sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal located between the first and second substrates and provided in the through-hole, and an underfill resin layer extending from between the semiconductor chip and the second substrate into the through-hole. The second patent is identical in its description, emphasizing the importance of this technology in enhancing semiconductor performance.

Career Highlights

Inku Kang is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing efficient and reliable semiconductor packages that meet the demands of modern electronics.

Collaborations

Inku collaborates with talented colleagues, including Chanhee Jeong and Hyunki Kim, who contribute to the innovative environment at Samsung Electronics.

Conclusion

Inku Kang's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents are a testament to his expertise and the impact he has made in the field.