Chanhee Jeong

Title: Chanhee Jeong: Innovator in Semiconductor Packaging

Introduction

Chanhee Jeong is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of two patents that reflect his innovative designs.

Latest Patents

His latest patents focus on a cutting-edge semiconductor package. This innovative package comprises a semiconductor chip situated on a first substrate. It features a mold layer covering the sidewall of the semiconductor chip and includes a through-hole for enhanced connectivity. Additionally, a second substrate is placed on the semiconductor chip, while a connection terminal is strategically located between the first and second substrates, facilitated by the through-hole. Finally, an underfill resin layer extends from the semiconductor chip to the second substrate, filling the space into the through-hole, thereby improving reliability and performance.

Career Highlights

Chanhee Jeong works at Samsung Electronics Co., Ltd., a leading company in the electronics industry known for its commitment to technological advancements and innovation. His work at this prestigious company has allowed him to push the boundaries of semiconductor technology, contributing to the efficiency and effectiveness of modern electronic devices.

Collaborations

Within Samsung, Chanhee collaborates with talented colleagues such as Hyunki Kim and Junwoo Park. Together, they form a dynamic team, working on innovative solutions that advance semiconductor technology and address the growing demands of the electronics market.

Conclusion

Chanhee Jeong's inventive spirit and dedication to innovation have positioned him as a key contributor in the semiconductor packaging sector. With two patents to his name and impactful collaborations, his contributions are sure to influence the future of electronics, promoting enhanced functionality and reliability in consumer technology.