The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Feb. 01, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junwoo Park, Suwon-si, KR;
Yongkwan Lee, Suwon-si, KR;
Seunghwan Kim, Suwon-si, KR;
Jungjoo Kim, Suwon-si, KR;
Jongwan Kim, Suwon-si, KR;
Taejun Jeon, Suwon-si, KR;
Junhyeung Jo, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a support wiring structure, a semiconductor chip on the support wiring structure, a connection structure on the support wiring structure and spaced apart from the semiconductor chip in a horizontal direction, an interposer including a central portion and an outer portion and having a recess portion provided on a lower surface of the central portion facing the semiconductor chip, wherein the central portion is on the semiconductor chip and the connection structure is connected to the outer portion, and a metal plate disposed along a portion of a surface of the recess portion inside the interposer, wherein the metal plate extends along a side surface of the outer portion of the interposer and the lower surface of the central portion of the interposer, and the metal plate has a cavity passing through a vicinity of a center of the metal plate planarly.