Junhyeung Jo

Title: Innovations by Junhyeung Jo in Semiconductor Packaging

Introduction

Junhyeung Jo is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Junhyeung Jo holds a patent for a semiconductor package that includes a dielectric layer on a substrate. This package features an opening that partially exposes the top surface of the substrate, along with a capacitor chip positioned on the substrate and within the opening of the dielectric layer. The design incorporates connection terminals that link the substrate and the capacitor chip, as well as dielectric patches on the substrate and in the opening of the dielectric layer. Additionally, an under-fill material fills the space between the substrate and the capacitor chip, which is divided into three regions, enhancing the overall performance of the semiconductor package.

Career Highlights

Junhyeung Jo is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the advancement of semiconductor solutions. His innovative approach has positioned him as a key player in the development of new semiconductor packaging techniques.

Conclusion

Junhyeung Jo's contributions to semiconductor packaging reflect his dedication to innovation and excellence in the field. His patent demonstrates a significant advancement in technology, showcasing the potential for improved performance in semiconductor devices. His work continues to influence the industry and inspire future innovations.