The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Dec. 01, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jungjoo Kim, Suwon-si, KR;
Yongkwan Lee, Suwon-si, KR;
Seung Hwan Kim, Suwon-si, KR;
Jongwan Kim, Suwon-si, KR;
Junwoo Park, Suwon-si, KR;
Taejun Jeon, Suwon-si, KR;
Junhyeung Jo, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor package including a dielectric layer on a substrate and having an opening that partially exposes a top surface of the substrate, a capacitor chip on the substrate and in the opening of the dielectric layer, connection terminals between the substrate and the capacitor chip and connecting the substrate and the capacitor chip to each other, dielectric patches on the substrate and in the opening of the dielectric layer, and an under-fill filling a space between the substrate and the capacitor chip may be provided. The space between the substrate and the capacitor chip includes a first region, a second region, and a third region between the first and second regions. The connection terminals are on the first region and the second region. The dielectric patches are on the third region.