The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
May. 18, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongkwan Lee, Hwaseong-si, KR;
Seunghwan Kim, Asan-si, KR;
Jungjoo Kim, Hwaseong-si, KR;
Jongwan Kim, Asan-si, KR;
Junwoo Park, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate, an interposer including a lower protective layer, conductive connectors connecting the package substrate to the interposer, a semiconductor chip arranged between the package substrate and the interposer, and cooling patches arranged between the semiconductor chip and the interposer and having cylindrical shapes, wherein each of the cooling patches includes the same material as each of the conductive connectors, a height of each of the cooling patches is less than or equal to a diameter of each of the cooling patches, and thermal conductivity of each of the cooling patches is greater than thermal conductivity of the lower protective layer.