Tokyo, Japan

Junji Fujino

This inventor holds 37 USPTO granted patents and 2 published patent applications and 3 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Mitsubishi Electric Corporation, Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Cooperation. Active years: 1995-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junji Fujino. Retrieved from https://idiyas.com/inventor/junji-fujino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37 

% Patents Active = 91.9


Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 65(Granted Patents)


Location History:

  • Amagasaki, JP (1995)
  • Chiyoda-ku, JP (2015 - 2016)
  • Tokyo, JP (1999 - 2024)

Company Filing History:


Years Active: 1995-2025

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Areas of Expertise:
Semiconductor Device
Power Module
Manufacturing Method
Heat Dissipation Structure
Dual Sealing Materials
Optical Device Package
Electrical Power
Lead Terminals
Soldering Method
Power Conversion Device
Semiconductor Packaging
Metal Film
37 patents (USPTO):Explore Patents

Title: The Innovations of Junji Fujino: A Pioneer in Semiconductor Technology

Introduction

Junji Fujino, an accomplished inventor based in Tokyo, Japan, is renowned for his significant contributions to semiconductor technology. With a remarkable portfolio of 36 patents, Fujino has established himself as a key figure in the industry through his innovative designs and methods that have revolutionized the packaging and functionality of semiconductor devices.

Latest Patents

Fujino's latest patents exemplify his ingenious approach to semiconductor design. One notable invention is the "Packaging of a semiconductor device with dual sealing materials." This invention introduces a semiconductor device comprised of an insulating layer, a conductive layer, and a semiconductor element positioned such that its upper surface faces the insulating layer. It includes an upper electrode on the semiconductor element and a wiring member connected to it, featuring a hollow portion and dual sealing materials. These materials work in tandem to secure the semiconductor element and wiring member effectively.

Another groundbreaking patent is the "Semiconductor device and method of manufacturing the same," which aims to mitigate non-filled portions within the device. This innovation features a base plate, a case, and a semiconductor element housed within the base plate and case. The inclusion of a lead electrode and a raised portion ensures efficient connectivity and increased reliability, sealed effectively by a dedicated sealing resin.

Career Highlights

Fujino has built an impressive career in the technology sector, having worked with prestigious companies such as Mitsubishi Electric Corporation and Mitsubishi Denki Kabushiki Kaisha. His work at these organizations has allowed him to contribute to various cutting-edge projects, fostering advancements in semiconductor technology and its applications.

Collaborations

Throughout his career, Fujino has collaborated with esteemed colleagues, including Shohei Ogawa and Yuji Imoto. These partnerships have facilitated a dynamic exchange of ideas and have been instrumental in driving forward some of Fujino's most notable inventions.

Conclusion

Junji Fujino's innovative spirit and dedication to advancing semiconductor technology are evident in his extensive patent portfolio and collaborative efforts. His contributions not only enhance the efficiency and functionality of semiconductor devices but also pave the way for future innovations in the field. As the industry continues to evolve, Fujino remains a pivotal figure, inspiring the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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