The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2023

Filed:

Sep. 04, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takamasa Iwai, Tokyo, JP;

Junji Fujino, Tokyo, JP;

Hiroshi Kawashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/367 (2013.01); H01L 23/50 (2013.01); H01L 24/48 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract

A lead member includes a plurality of lead terminals, and the lead terminals extend from the inside to the outside of a mold resin. Each of the lead terminals has a base portion and a tip end portion on the outside of the mold resin. The base portion is disposed on a region side having a semiconductor element and extends in a direction protruding from the mold resin. The tip end portion extends in a direction different from the base portion and is disposed on the opposite side to a region having the semiconductor element as viewed from the base portion. The length by which the base portion extends differs between a pair of lead terminals adjacent to each other, among the lead terminals. At least a surface of the base portion of each of the lead terminals is covered with a coating resin.


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