The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Nov. 19, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kazuma Noda, Tokyo, JP;

Satoshi Kondo, Tokyo, JP;

Junji Fujino, Tokyo, JP;

Michio Ogawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/495 (2013.01); H01L 23/498 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/32157 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01);
Abstract

An object is to provide a technique capable of suppressing an occurrence of a non-filled portion. A semiconductor device includes a base plate, a case, and a semiconductor element. The semiconductor element is disposed in a space of the base plate and the case. The semiconductor device includes a lead electrode. The lead electrode is connected to an upper surface of the semiconductor element in the space. The semiconductor device includes a raised portion. The raised portion is disposed on an upper surface of the lead electrode in the space. The semiconductor device includes a sealing resin. The sealing resin seals the semiconductor element and the lead electrode in the space.


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