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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10978366 B1

PDFFull Text
Date of Patent:
Apr. 13, 2021

Filed:

Apr. 27, 2018

Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Junji Fujino, Tokyo, JP;

Yuji Imoto, Tokyo, JP;

Shohei Ogawa, Tokyo, JP;

Mikio Ishihara, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 23/15 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/56 (2013.01); H01L 23/15 (2013.01); H01L 23/3107 (2013.01); H01L 23/492 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40137 (2013.01);
Abstract

An object is to provide a power module in which adhesion of a sealing resin is sufficient and which is highly reliable. The power module includes: an insulative board in which a pattern of a conductor layer is formed on a ceramic plate; power semiconductor elements placed on the insulative board; lead frames each in a plate shape connecting from electrodes of the power semiconductor elements to screw-fastening terminal portions; and a sealing resin portion that seals connection portions between the power semiconductor elements and the lead frames, and regions around the connection portions; wherein, in the lead frames, opening portions are formed at positions where each of the lead frames at least partly overlaps, in planar view, with a portion of the insulative board on which the conductor layer is not formed.

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