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Shohei Ogawa

USPTO Granted Patents = 12 (Patent Applications = 5)

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 17(Granted Patents)

Location History:

Chiyoda-ku, JP (2016)
Tokyo, JP (2017 - 2024)

Company Filing History:

11 out of 15,844

Mitsubishi Electric Corporation

Mitsubishi Electric Cooperation

Years Active: 2016-2024

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11901326 - Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device (2024-02-13),

2. 11804414 - Semiconductor device comprising a lead electrode including a through hole (2023-10-31),

3. 11557531 - Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device (2023-01-17),

4. 11398447 - Semiconductor device and method for producing semiconductor device (2022-07-26),

5. 11244922 - Semiconductor device (2022-02-08),

6. 11183479 - Semiconductor device, method for manufacturing the same, and power conversion device (2021-11-23),

7. 10978366 - Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module (2021-04-13),

8. 10727163 - Semiconductor device (2020-07-28),

9. 10559538 - Power module (2020-02-11),

10. 9899345 - Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power (2018-02-20),

11. 9818716 - Power module (2017-11-14),

12. 9236316 - Semiconductor device and method for manufacturing the same (2016-01-12),

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