The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Mar. 21, 2013
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 23/24 (2006.01); H01L 23/36 (2006.01); H01L 23/473 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 23/053 (2006.01); H01L 25/18 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 21/563 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/495 (2013.01); H01L 24/34 (2013.01); H01L 24/97 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/49811 (2013.01); H01L 25/18 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15787 (2013.01);
Abstract
The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray.