The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Mar. 12, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Yutaka Yoneda, Tokyo, JP;
Junji Fujino, Tokyo, JP;
Tadayoshi Hata, Tokyo, JP;
Jin Sato, Isahaya, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.