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For the Inventor, By the Inventor

Miaoli, Taiwan

Jui-Meng Jao

This inventor holds 11 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2006-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jui-Meng Jao. Retrieved from https://idiyas.com/inventor/jui-meng-jao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 58(Granted Patents)


Location History:

  • Miaoli County, TW (2007 - 2009)
  • Miao-Li Hsien, TW (2006 - 2013)

Company Filing History:

goldMedal11 out of 7,269 
 
United Microelectronics Corp.
 patents

Years Active: 2006-2013

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11 patents (USPTO):Explore Patents
1. 8357988 - Die seal ring (2013-01-22),
2. 8022509 - Crack stopping structure and method for fabricating the same (2011-09-20),
3. 7696606 - Metal structure (2010-04-13),
4. 7649268 - Semiconductor wafer (2010-01-19),
5. 7518211 - Chip and package structure (2009-04-14),
6. 7387950 - Method for forming a metal structure (2008-06-17),
7. 7268440 - Fabrication of semiconductor integrated circuit chips (2007-09-11),
8. 7256475 - On-chip test circuit for assessing chip integrity (2007-08-14),
9. 7250670 - Semiconductor structure and fabricating method thereof (2007-07-31),
10. 7176555 - Flip chip package with reduced thermal stress (2007-02-13),
11. 7026234 - Parasitic capacitance-preventing dummy solder bump structure and method of making the same (2006-04-11),

Title: The Innovations of Jui-Meng Jao: A Pioneer in Semiconductor Technology

Introduction

Jui-Meng Jao, located in Miao-Li Hsien, Taiwan, is an accomplished inventor with an impressive portfolio of 11 patents. His work primarily focuses on advancements in semiconductor technologies, which are critical for modern electronics. Jao's contributions have significantly impacted the industry, showcasing his innovative spirit and technical expertise.

Latest Patents

Jui-Meng Jao's latest patents demonstrate his commitment to enhancing semiconductor design and functionality. One of his notable inventions is the "Die Seal Ring," which is described as a die seal ring situated outside of a die region of a semiconductor substrate. This invention includes a first isolation structure, a second isolation structure, and at least one third isolation structure strategically placed to improve the performance of semiconductor devices.

Another significant patent is the "Crack Stopping Structure and Method for Fabricating the Same." This invention features a semiconductor substrate divided into various regions, including a die region and a scribe line region, with a sophisticated metal interconnect structure. The invention also employs dielectric layers to ensure the metrical integrity and durability of the semiconductor components.

Career Highlights

Jui-Meng Jao has built a distinguished career at United Microelectronics Corporation, where he has leveraged his skills to create innovative solutions in semiconductor technology. His experience and contributions have positioned him as a leading figure in the field, influencing various developments and applications.

Collaborations

Throughout his career, Jao has collaborated with notable coworkers, including Chien-Li Kuo and Kai-Kuang Ho. Their combined expertise has fostered an environment of creativity and innovation, resulting in substantial advancements in semiconductor technologies.

Conclusion

Jui-Meng Jao's journey as an inventor reflects his dedication to pushing the boundaries of technology. With a strong portfolio of patents, he continues to contribute significantly to the semiconductor industry, inspiring future innovations and enhancements. His work exemplifies the vital role inventors play in the evolving landscape of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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