The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Nov. 11, 2005
Jui-meng Jao, Miaoli County, TW;
Jui-Meng Jao, Miaoli County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
The invention is directed to a chip comprising a substrate having a plurality of pads located thereon and a passivation layer located over the substrate, wherein the passivation layer has a plurality of openings and recesses formed therein and the openings expose the pads respectively. During the later performed packaging process, a molding compound can fill out the recesses on the passivation layer to provide a stronger mechanical adhesion between the molding compound and the passivation layer. Therefore, the peeling issue of the molding compound can be solved.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile