The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2011

Filed:

Nov. 28, 2008
Applicant:

Jui-meng Jao, Miao-Li Hsien, TW;

Inventor:

Jui-Meng Jao, Miao-Li Hsien, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/78 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A crack stopping structure is disclosed. The crack stopping structure includes a semiconductor substrate having a die region, a die seal ring region, and a scribe line region; a metal interconnect structure disposed on the semiconductor substrate of the scribe line region; and a plurality of dielectric layers disposed on the semiconductor substrate of the die region, the die seal ring region, and the scribe line region. The dielectric layers include a first opening exposing the surface of the metal interconnect structure of the scribe line region and a second opening exposing the dielectric layer adjacent to the metal interconnect structure such that the metal interconnect structure and the exposed portion of the dielectric layer form a step.


Find Patent Forward Citations

Jao, Jui-Meng. (2011). Crack stopping structure and method for fabricating the same (U.S. Patent No. 8022509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8022509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…