This inventor holds 29 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Advanced Technology Materials, Inc.. Active years: 2007-2024.
IDiyas Innovation Intelligence. (2026). Inventor Profile: Juan E Dominguez. Retrieved from https://idiyas.com/inventor/juan-e-dominguez
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Calculating rank
USPTO Granted Patents = 29 (Patent Applications = 6)
% Patents Active = 48.3
Average Co-Inventor Count = 3.4
ph-index = 7
Forward Citations = 167(Granted Patents)
Location History:
- Portland, OR (US) (2008)
- Hillsboro, OR (US) (2007 - 2013)
- Chandler, AZ (US) (2021)
- Gilbert, AZ (US) (2019 - 2023)
Company Filing History:

Intel Corporation
Advanced Technology Materials, Inc.
where one patent can have more than one assignee
Years Active: 2007-2024
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Areas of Expertise:
Drum Pedal Device
System In Package
Active Package Substrate
Hybrid Die Stacking
Atomic Layer Deposition
Tunable Gate Electrode
Copper Precursors
Nanotube Fabrication
Optical Coatings
Silicon-Alloy Barrier Layers
Deposition Methods
Metal-Nitride Films
29 patents (USPTO):Explore Patents
Couldn't find inventor
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
6 patents pending:
IDiyas Innovation Intelligence. (2026). Inventor Profile: Juan E Dominguez. Retrieved from https://idiyas.com/inventor/juan-e-dominguez
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]