Juan E Dominguez

This inventor holds 29 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Advanced Technology Materials, Inc.. Active years: 2007-2024.

USPTO Granted Patents = 29 (Patent Applications = 6)

% Patents Active = 48.3

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 167(Granted Patents)

Location History:

Portland, OR (US) (2008)
Hillsboro, OR (US) (2007 - 2013)
Chandler, AZ (US) (2021)
Gilbert, AZ (US) (2019 - 2023)

Company Filing History:

Advanced Technology Materials, Inc.

patents

where one patent can have more than one assignee

Years Active: 2007-2024

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Areas of Expertise:

Drum Pedal Device

System In Package

Active Package Substrate

Hybrid Die Stacking

Atomic Layer Deposition

Tunable Gate Electrode

Copper Precursors

Nanotube Fabrication

Optical Coatings

Silicon-Alloy Barrier Layers

Deposition Methods

Metal-Nitride Films

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12112726 - Remotely actuated drum pedal device and method (2024-10-08),

2. 11817438 - System in package with interconnected modules (2023-11-14),

3. 11694987 - Active package substrate having anisotropic conductive layer (2023-07-04),

4. 11145632 - High density die package configuration on system boards (2021-10-12),

5. 10790257 - Active package substrate having anisotropic conductive layer (2020-09-29),

6. 10497669 - Hybrid die stacking (2019-12-03),

7. 8425987 - Surface charge enhanced atomic layer deposition of pure metallic films (2013-04-23),

8. 8344352 - Using unstable nitrides to form semiconductor structures (2013-01-01),

9. 8319287 - Tunable gate electrode work function material for transistor applications (2012-11-27),

10. 8222746 - Noble metal barrier layers (2012-07-17),

11. 7982204 - Using unstable nitrides to form semiconductor structures (2011-07-19),

12. 7964746 - Copper precursors for CVD/ALD/digital CVD of copper metal films (2011-06-21),

13. 7964174 - Nanotube growth and device formation (2011-06-21),

14. 7858525 - Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill (2010-12-28),

15. 7851360 - Organometallic precursors for seed/barrier processes and methods thereof (2010-12-14),

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6 patents pending:

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