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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Juan E Dominguez

USPTO Granted Patents = 28 

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 165(Granted Patents)


Location History:

  • Portland, OR (US) (2008)
  • Hillsboro, OR (US) (2007 - 2013)
  • Chandler, AZ (US) (2021)
  • Gilbert, AZ (US) (2019 - 2023)

Company Filing History:

goldMedal26 out of 54,664 
 
Intel Corporation
 patents
silverMedal1 out of 622 
 
Advanced Technology Materials, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2007-2024

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28 patents (USPTO):Explore Patents
1. 12112726 - Remotely actuated drum pedal device and method (2024-10-08),
2. 11694987 - Active package substrate having anisotropic conductive layer (2023-07-04),
3. 11145632 - High density die package configuration on system boards (2021-10-12),
4. 10790257 - Active package substrate having anisotropic conductive layer (2020-09-29),
5. 10497669 - Hybrid die stacking (2019-12-03),
6. 8425987 - Surface charge enhanced atomic layer deposition of pure metallic films (2013-04-23),
7. 8344352 - Using unstable nitrides to form semiconductor structures (2013-01-01),
8. 8319287 - Tunable gate electrode work function material for transistor applications (2012-11-27),
9. 8222746 - Noble metal barrier layers (2012-07-17),
10. 7982204 - Using unstable nitrides to form semiconductor structures (2011-07-19),
11. 7964746 - Copper precursors for CVD/ALD/digital CVD of copper metal films (2011-06-21),
12. 7964174 - Nanotube growth and device formation (2011-06-21),
13. 7858525 - Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill (2010-12-28),
14. 7851360 - Organometallic precursors for seed/barrier processes and methods thereof (2010-12-14),
15. 7749906 - Using unstable nitrides to form semiconductor structures (2010-07-06),

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