The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Jul. 18, 2011
Applicants:

Juan E. Dominguez, Hillsboro, OR (US);

Adrien R. Lavoie, Beaverton, OR (US);

John J. Plombon, Portland, OR (US);

Joseph H. Han, San Jose, CA (US);

Harsono S. Simka, Saratoga, CA (US);

Inventors:

Juan E. Dominguez, Hillsboro, OR (US);

Adrien R. Lavoie, Beaverton, OR (US);

John J. Plombon, Portland, OR (US);

Joseph H. Han, San Jose, CA (US);

Harsono S. Simka, Saratoga, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Incompatible materials, such as copper and nitrided barrier layers, may be adhered more effectively to one another. In one embodiment, a precursor of copper is deposited on the nitrided barrier. The precursor is then converted, through the application of energy, to copper which could not have been as effectively adhered to the barrier in the first place.


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