Newberg, OR, United States of America

Adrien Lavoie

Average Co-Inventor Count = 4.0

ph-index = 22

Forward Citations = 3,956(Granted Patents)

Forward Citations (Not Self Cited) = 3,024(Sep 21, 2024)

DiyaCoin DiyaCoin 7.35 

Inventors with similar research interests:


Location History:

  • St. Hellens, OR (US) (2007)
  • St. Helens, OR (US) (2009)
  • Portland, OR (US) (2010 - 2012)
  • Beaverton, OR (US) (2008 - 2013)
  • Tualatin, OR (US) (2016)
  • Newberg, OR (US) (2015 - 2024)


Years Active: 2007-2025

where 'Filed Patents' based on already Granted Patents

157 patents (USPTO):

Title: Adrien R Lavoie: Innovator in Atomic Layer Deposition

Introduction:

Adrien R Lavoie, based in Beaverton, Oregon, is a distinguished inventor in the field of atomic layer deposition (ALD). With an impressive number of 133 patents to his name, Lavoie has made significant contributions to the advancement of ALD processes. His work focuses on improving the deposition techniques and overall efficiency of ultrathin film formation.

Latest Patents:

Lavoie's recent patents highlight his expertise in ALD methodologies. One such patent is the "Method of Atomic Layer Deposition." This invention involves depositing ultrathin films with reduced wafer-to-wafer variation. By exposing the substrate to specific soak gases, Lavoie's method optimizes the temperature and plasma exposure operation during the ALD cycle, leading to improved film deposition.

Another notable patent called "Method of Improving Deposition Induced CD Imbalance" addresses the issue of non-uniform carbon-based deposition. Lavoie's technique involves pretuning the deposition, resulting in selective removal of certain portions of the carbon-based film. By integrating atomic layer deposition with subsequent processes, more uniform features can be achieved on the wafer.

Career Highlights:

Lavoie has provided his expertise to several leading companies in the semiconductor industry, including Lam Research Corporation and Intel Corporation. During his tenure, he has made significant contributions to process optimization and technology development in the field of ALD.

Collaborations:

Throughout his career, Lavoie has had the privilege of collaborating with esteemed professionals in the industry. Notably, he has worked closely with Shankar Swaminathan and Purushottam Kumar. Their collective expertise and shared vision have led to groundbreaking advancements in atomic layer deposition methodologies.

Conclusion:

Adrien R Lavoie's exceptional work in atomic layer deposition has significantly advanced the field, leading to improved techniques for depositing ultrathin films. With an impressive portfolio of 133 patents, his dedication to innovation and collaboration with industry experts has made a substantial impact on the semiconductor industry. We anticipate that Lavoie's contributions will continue to shape the future of ALD, inspiring further advancements in this vital field of technology.

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